zangtian Electronic - The RFID ,Smart Cards ,access control Manufacturer

Zangtian is a company with 10 years of history in professional smart card field whose products have been marketing around the world and got a good reputation. Cooperate with us is your great choice.
　

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What can Zangtian do for you？

We will be able to provide you with almost all the smart card and related products to meet the majority of your individual need. Your satisfaction is our expectation.
　

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How to order us?

You can contact us either through the online tool (Skype or MSN) or the email info@cardzt.com.
We will reply you in 24 hours.

In order to get a effective reply, please tell us more information of the products you want.
You can get the guide below.
1) Cards
A. Blank cards
Please tell us the chip (if you need) and the quantity you want.
If you need non-ISO size, please tell us the size as well.

B. Cards with other crafts
a.Printing (incl. silk printing,offset printing, metallic printing etc)
Please show us the design.
Please read the artwork instruction, which tells how to prepare good artworks for us.

b. Magnetic stripes
Please tell us the coercivity.
We usually provide 300oe,650 oe,2750 oe,4000 oe.
And the width of magnetic strip is about 12.7mm. And the color is brown (loco) or black (hico).
If you need the other width or color, please tell us as well.

If you also need other crafts like signature panel,barcode,scratch panel,serials number,hot stamp,embossing etc, please tell us as well.

C. Keychains and disk tags and stick tags and on metal tags
Please tell us following
a. Product name
b. Chip (if you need)
c. Color (if available)
d. Estimated quantity.

D. Readers
Please tell us following
a. Product name
b. Interface
We also provide one reader with different interface. But it takes more.

c. Tags supported
For different function, the price is different.
　

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How can I get the samples?

In order to expland our market and work with good potential partner, we would like to provide a few free samples to you. And you just need to pay for the shipping fee.

If you need more samples, please pay for them as well.
　

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How can I send the total money?

Once you give us the offical order and we accept it, we will send you a contract with our bank information. So you can transfer the money to us before the shipping. It usually takes 3 or 4 work days for us to confirm the money from the bank.
　

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How can you send me the items?

We usually send the goods to you by express, by air and by sea.
a. By express
This is a door to door way.

If you have the global express account, we can use it.
If you don’t have it, we can use our global express account. Of course, we will show you the fee of using our express account firstly.

b. By air or by sea
You need to pick up the goods by yourself from the sea port or airport.

If you have own forwarder in China, we can contact him or her.
If you don’t, please tell us your appointed airport name or sea port name. Then we can get the totall amount from our own forwarder to show you.
　

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Could you announce me the hidden fees in this regard?

Except the amount which you need to pay for us, you may need to pay to your local customs
You can get the information about the fee from your local customs or the express.

It takes some extra fee to your airport or sea port.
　

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Could you send me the price list of all products which you list in your website?

We usually provide pricelist to our old customers.
As to the new customer, sorry, we can’t do this for some reasons. If you have any question, you can ask us. And we will reply to you on time.
　

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What is Ultrasonic plastic-welding?

Plastic welding is used for a huge variety of product ranging from blister packs, cartons and small consumer goods up to car fuel tanks and dashboards. It works by generating heat exactly where it is needed - at the interface between the components to be joined. The components are clamped between a vibrating sonotrode and a fixed mounting. Strangely, the vibrations are usually applied perpendicular to the contact surface, although much of this vibration may be converted to in-plane movement. This also has the advantage that the clamping pressure will keep the sonotrode in contact with the component - serrated surfaces are generally not required. Best results are achieved when the components are clamped close to the interface ("near-field" welding) but if this is not possible then the process can still work at a distance ("far-field").
Staking, or insertion, is a variation of this process in which a metal part (generally a threaded bush) is driven into a hole in a plastic component, which then solidifies around it to form a permanent join. This is a convenient method of producing strong tapped holes in a plastic part.
　

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What is Chip-on-Board (COB)?

Chip-on-Board, or COB, refers to the semiconductor assembly technology wherein the microchip or die is directly mounted on and electrically interconnected to its final circuit board, instead of undergoing traditional assembly or packaging as an individual IC. The elimination of conventional device packaging from COB assemblies simplifies the over-all process of designing and manufacturing the final product, as well as improves its performance as a result of the shorter interconnection paths.

The COB process consists of just three major steps: 1) die attach or die mount; 2) wirebonding; and 3) encapsulation of the die and wires. A variant of COB assembly, the flip-chip on board (FCOB), does not require wirebonding since it employs a chip whose bond pads are bumped, which are the ones that connect directly to designated pads on the board. As such, FCOB's have their chips facing downward on the board (hence the name 'flipchip'). Aside from encapsulation, it is also necessary to 'underfill' a flip chip to protect its active surface and bumps from thermo-mechanical and chemical damage

Die attach basically consists of applying a die attach adhesive to the board or substrate and mounting the chip or die over this die attach material. Adhesive application may be in the form of dispensing, stencil printing, or pin transfer. Die placement must be accurate enough to ensure proper orientation and good planarity of the die. This is followed by a curing process (such as exposure to heat or ultraviolet light) that allows the adhesive to attain its final mechanical, thermal, and electrical properties. After curing, organic contaminants must be removed either by plasma or solvent cleaning so as not to affect the wirebonding process.

The wirebonding process is similar to that used in traditional semiconductor assembly, i.e., thermosonic Au or Cu ball bonding or ultrasonic Al wedge bonding may be employed to connect wires between the die and the board or substrate. Chip-to-chip wirebonding may also be done for COB assembly. Needless to say, the bond pads of the die and the board or substrate must be free of any contaminants and defects to ensure the formation of good and reliable bonds.

Finally, the die and bond wires are encapsulated to protect them from mechanical and chemical damage. Encapsulation is generally done by dispensing a liquid encapsulant material (usually epoxy-based) over the die and wires or by transfer molding. Encapsulants also need to undergo curing, the process of which depends on the type of encapsulant used.

Advantages offered by COB technology include: 1) reduced space requirements; 2) reduced cost; 3) better performance due to decreased interconnection lengths and resistances; 4) higher reliability due to better heat distribution and a lower number of solder joints; 5) shorter time-to-market; and 6) better protection against reverse-engineering.

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What is offset printing?

Offset printing is a widely used printing technique which is printed on PVC (PETG) or paper is made up of a combination of the 4 process colors of printing-Cyan, Magenta, Yellow, and black. The ink is spread on metal plate with etched images, and then transferred to another surface such as rubber blanket. The final stage of printing is apply the image to PVC (PETG) or paper by pressing it against the surface (such as the rubber blanket). For advantage of offset printing, there is a consistent high quality of color images and can print realistic photo images , complicated pictures(contains multiple colors). Images are also sharper and cleaner. In opposite of Screen printing, Offset printing is not unable to print out the high-definition colors. The type of printing is most efficient and economical when printing a large volume and printing the same design image. Offset printing, there is the overlay(the protection layer), can protect the proximity card from cutting, also can be used in a long time.
　

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What is Silk Screen printing?

The process is known as screen printing. A screen is made of a piece of porous, finely woven fabric (originally silk, called Silk Screen printing, but nowadays made of polyester or nylon) stretched over a wood or aluminum frame. Firstly, no using area of the screen is blocked by a non-permeable material where wont to be printed; that is, the open spaces are where the ink will appear. Secondly, the silk screen is placed above PVC sheet, Ink is placed on top of the silk screen (one color once), and use machine pressure method to push the ink evenly into the silk screen openings. Ink passes through the open of silk screen is printed onto PVC sheet. If more than one color, the process is same as above. Compare with Offset Printing, Silk Screen printing can print out high-definition colors, but not able to print like photo reality. Silk Screen printing also have the overlay to protect the proximity card surface to keep using in a long time.

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What are the differences between ISO 14443A, 14443B and C proximity coupling smart card?

ISO 14443 has two variants, Type A and Type B. ISO 14443A was accepted by the ISO committee in 1997. It is the first ISO standard for 13.56 MHz frequency contactless card which was developed by Mikron Austria and acquired by Phillips in 1996. Currently, ISO 14443A is the most widely used contactless standard in the world, mainly in transport applications.
ISO 14443B was approved by the ISO committee in 1998. ISO 14443B has a number of advantages over ISO 14443A:
1. Unlike ISO 14443A uses 100% modulation depth, it means that the reader stops emitting the field for defined periods of time. The modulation depth for ISO 14443B is only 10% which preserves the continuity of the clock.
2. No patents on communication coding.
3. Communication speeds of up to 847 KHz.
4. Adopted as a national standard by many countries, such as US, China, Japan, etc.
A third variant of the ISO 14443 standard, Type C, was developed by Sony, however, it was abandoned by the ISO/IEC committee and now is renamed as Felica.
*Securitag Assembly Group (SAG) is able to provide ISO 14443 proximity coupling smart card and tag with the following RFID technologies:
ISO 14443A: Mifare 1K, Mifare 4K, Mifare Ultralight, Mifare DESFire, SLE66R35
ISO 14443B: AT88RF020, SR176, SRIX512, SRIX4K
Felica (ISO 14443C): RC-S919
　

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What is RFID?

Radio frequency identification, or RFID, is a generic term for technologies that use radio waves to automatically identify people or objects. There are several methods of identification, but the most common is to store a serial number that identifies a person or object, and perhaps other information, on a microchip that is attached to an antenna (the chip and the antenna together are called an RFID transponder or an RFID tag). The antenna enables the chip to transmit the identification information to a reader. The reader converts the radio waves reflected back from the RFID tag into digital information that can then be passed on to computers that can make use of it.

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What is the difference between EM4102 and EM4100?

About the electrical function, there is no difference between EM4100 and EM4102. Both RFID chips work at 125 KHz and with 64 bit read only memory size. The major differences are that EM4102 chip has gold bumps on the die and there is a bit smaller response capacitance and more wire turns. So EM4102 is much expensive and good at long distance reading.

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What are some of the most common applications for RFID?

RFID is used for everything from tracking cows and pets to triggering equipment down oil wells. It may sound trite, but the applications are limited only by people's imagination. The most common applications are payment systems (Mobil Speedpass and toll collection systems, for instance), access control and asset tracking. Increasingly, retail/CPG and pharma companies are looking to use RFID to track goods within their supply chain, to work in process and for other applications.

　

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How do I know which frequency is right for my application?

Different frequencies have different characteristics that make them more useful for different applications. For instance, low-frequency tag use less power and are better able to penetrate non-metallic substances. They are ideal for scanning objects with high-water content, such as fruit, but their read range is limited to less than a foot (0.33 meter). High-frequency tag work better on objects made of metal and can work around goods with high water content. They have a maximum read range of about three feet (1 meter). UHF frequencies typically offer better range and can transfer data faster than low- and high-frequencies. But the